Power fail circuit for multi-storage-device arrays

ABSTRACT

Some embodiments include a multi-storage-device array (e.g., a SSD tray, a SSD sled or a SSD rack) having multiple drives (e.g., solid-state drives). The multi-storage-device array can have an enclosure around the drives, a processor and a network interface, and implement a power failure management circuit. The power failure management circuit can include an electric probe that detects a power failure. Upon detecting the power failure, the power failure management circuit sends an interrupt signal to a drive controller to flush data in volatile-memory (e.g., write cache, firmware cache, look-up table cache, or other random access memory) into non-volatile memory (e.g., flash memory). The power failure management circuit can include a system-level holdup energy storage that retains power after power failure to support flushing of the data from the volatile memory during the power failure.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.14/670,758, filed on Mar. 27, 2015, entitled “POWER FAIL CIRCUIT FORMULTI-STORAGE-DEVICE ARRAYS”, which is incorporated herein by referencein its entirety.

BACKGROUND

Multi-storage-device arrays can take the form of a tray, a sled, a rack,a cabinet, etc. These arrays can host multiple data storage devices(e.g., one or more solid state drives, one or more hard disk drives, oneor more tape drives, or any combination thereof, also referred to hereinas simply “storage devices”) and a central system of shared components.For example, a processor that implements a data service enabling clientsto access to the storage devices. A client is a consumer of the dataservice, and can execute at one or more client computing devices. Thecontroller can access the storage devices as independent drives bycommunicating with storage controllers in the storage devices throughrespective storage adapters. The central system can further include acentral network interface, a central volatile memory space, and acentral power interface. Sharing a central system (e.g., a centralcontroller, a central network interface, a central power interface, acentral volatile memory space, etc.) among the storage devices conserveelectronic resources. Using these centralized components further enablesthe storage space of the multi-storage-device to flexibly expand orcontract without needing to add additional supportive components (e.g.,an additional network interface, power interface, etc.)

Multi-storage-device arrays can be subject to power failures. Forexample, a power failure can be due to power grid outage, hardwarefailure, or man-made mistakes (e.g., an information technology (IT)technician pulling a storage device out of the array or pulling thearray out of a system having multiple arrays). When writing large amount(also, “chunk”) of information into a single storage device, thewrite-speed of the storage device may be insufficient to accommodate asynchronous write relative to the data transfer speed via the storageadapters. Accordingly, storage devices may include a write cache. Awrite cache generally comprises data storage that has much fastertransfer speeds than other types of data storage devices. Write cachestypically use volatile memory. Thus, during a power failure event,unless a specific instruction to flush the write cache is given, thewrite cache can lose data when experiencing the power failure event.

Some brands of storage devices have proprietary power failure recoverymechanisms. However, these power failure recovery mechanisms differ fromone brand to another. Also, not all storage devices, including ones withattributes that are desirable for a multi-storage-device array, have apower failure recovery mechanism. This presents a challenging problemwhen storage devices are selected based on those desirable attributes,leaving the multi-storage-device array with at least a subset of itsstorage devices (e.g., storage “drives”) without power failure recoverymechanisms. Moreover, storage devices having power failure recoverymechanisms tend to be more expensive than those not having suchmechanisms.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram illustrating a multi-storage-device array witha power failure management mechanism, in accordance with variousembodiments.

FIG. 2 is a block diagram illustrating a storage device within amulti-storage-device array, in accordance with various embodiments.

FIG. 3 is a block diagram of a power failure management circuit within amulti-storage-device array, in accordance with various embodiments.

FIG. 4 is a flow chart of a method of data protection responsive to apower failure event in a multi-storage-device array, in accordance withvarious embodiments.

The figures depict various embodiments of this disclosure for purposesof illustration only. One skilled in the art will readily recognize fromthe following discussion that alternative embodiments of the structuresand methods illustrated herein may be employed without departing fromthe principles of embodiments described herein.

DETAILED DESCRIPTION

Several embodiments include a multi-storage-device array (e.g., astorage device tray, a storage device sled, a storage device rack) witha system-level power failure management circuit. Themulti-storage-device array includes multiple storage devices. Thestorage devices can include one or more of solid-state drives (SSDs),hard disk drives (HDs), tape drives, or other non-volatile storagedrives. The multi-storage-device array can have an enclosure protectingthe storage devices, a central processor (e.g., single core processor ormulti-core processor), a network interface, and a switching network(e.g., a serial attached small computer system interface (SAS) expanderor a referral component interface express (PCIe) switch). The centralprocessor can access the storage devices as “storage drives.” Themulti-storage-device array can provide, via the network interface, adata storage service for clients to read and write data to its storagedrives.

As a system, the multi-storage-device array can implement a powerfailure management circuit. The power failure management circuit candetect power failure event at system-level of the multi-storage-devicearray. In some embodiments, the power failure management circuit canalso detect power failure events that affect only a subset of thestorage devices. The power failure management circuit can also execute adata protection process at the system-level. The power failuremanagement circuit can include an electric probe (e.g., a voltagecomparator or a current meter) that determines whether a power supply(e.g., for the entire system or part of the system) is functioningabnormally. In some embodiments, the power failure management circuitincludes multiple electric probes, each of which respectively determineswhether power supplied to each of the drives is functioning abnormally.Abnormal functioning can be characterized by electrical current and/orvoltage being above a maximum threshold or below a minimum threshold.Abnormal functioning of a power supply (e.g., the system-level powersupply to the array) or power delivery mechanism (e.g., powertrain to astorage device) can be considered to be a power failure event.

A system-level controller (e.g., a controller dedicated to the powerfailure management circuit or the central processor of themulti-storage-device array) can monitor sensor readings from the one ormore electric probes and detect a power failure event based on thesensor readings. The system-level controller can generate and send amaximum priority command to all or a subset of the drives to flush datafrom volatile-memory (e.g., a write cache, a firmware cache, a look-uptable cache, metadata or front end processing cache or other randomaccess memory) to non-volatile/persistent memory (e.g., flash memory).In some embodiments, the system-level controller selects the subset ofthe drives to send the maximum priority command based on whether theselected drives are affected by the power failure event. When the powerfailure event is system-wide, the system-level controller sends themaximum priority command to all of the drives. In some embodiments, thesystem-level controller selects the subset of the drives based onwhether the selected drives have drive-level power failure protection(e.g., backup capacitor, battery, and/or data protection/redundancy). Insome embodiments, the system-level controller selects the subset basedon whether the selected drives are affected and whether the affecteddrives have drive level power failure protection.

The power failure management circuit can include one or more holdupenergy storages (e.g., one or more batteries or capacitors) that retainpower after a power failure event to support flushing of the data fromthe volatile memory during the power failure event. In some embodiments,responsive to detecting the power failure event and prior to sending themaximum priority command, the system-level controller powers off othercomponents (e.g., other than the drives receiving the flushing command)in the multi-storage-device array to reduce power drained from theenergy storage and to prevent any further write commands/requests intothe drives.

Turning now to the figures, FIG. 1 is a block diagram illustrating amulti-storage-device array 100 with a power failure managementmechanism, in accordance with various embodiments. Themulti-storage-device array 100 includes two or more data storage devices102. The multi-storage-device array 100 can be a tray, a cabinet, asled, or other enclosures having multiple storage devices sharing dataprocessing components. The data storage devices 102 can be one or moreof solid-state drives, hard disk drives, tape drives, or other datastorage devices (e.g., non-volatile data storage drives).

The multi-storage-device array 100 can share one or more power modules(e.g., a power supply module 104A, a power supply module 104B, etc.,collectively as the “power supply modules 104”). The power supplymodules 104 can be connected to a power grid to provide power tocomponents of the multi-storage-device array 100. For example, the powersupply module 104A can convert three phase alternating current (AC) fromthe power grid to a powertrain 108A (e.g., a direct current (DC)powertrain) to at least a subset of the data storage devices 102 and thepower supply module 104B can convert three phase AC from the power gridto a powertrain 108B (e.g., a DC powertrain). The multi-storage-devicearray 100 can share one or more backup battery units (BBU) (e.g., a BBU110A, a BBU 110B, etc., collectively as the “BBU 110”).

The multi-storage-device array 100 can include a power failuremanagement circuit 112. The power failure management circuit 112 can bea system-level circuit that manages detection of power failure eventsand data protection responsive to the power failure events.

Other than the power related components described above, themulti-storage-device array 100 can include a number of centralcomponents that are shared and/or coupled to the data storage devices102. For example, the multi-storage-device array 100 can include anetwork interface 120, a central processor 122, a memory device 124, aswitching network 126, or any combination thereof.

The network interface 120 enables the central processor 122 tocommunicate with external clients (e.g., other computing devicesconnected to the multi-storage-device array 100 via a network (e.g., awireless or a wired network). The network can be a local area network(LAN) or a wide area network (WAN). In some embodiments, the networkinterface 120 is configured to facilitate communication amongst the datastorage devices 102. In some embodiments, the switching network 126 isconfigured to facilitate communication amongst the central processor122, the data storage devices 102, and/or the power failure managementcircuit 112. In some embodiments, the network interface 120 isconfigured to facilitate communication amongst the data storage devices102, the central processor 122, and/or the power failure managementcircuit 112.

The central processor 122 can be configured to process communicationbetween the external clients and the data storage devices 102. Forexample, the central processor 122 can implement an operating systemthat mounts the data storage devices 102 as its storage drives. Thecentral processor 122 can execute a client service process on theoperating system to read or write from one or more of the data storagedevices 102 based on client requests from the external clients. Thememory device 124 can provide runtime memory for the operating systemand/or other applications running thereon (e.g., the client serviceprocess).

The multi-storage-device array 100 includes an enclosure 128. Theenclosure 128 provides physical structure to the multi-storage-devicearray 100. The enclosure 128 can form the shape of a tray, sled, a rack,or any combination thereof. The enclosure 128 can substantially surroundthe data storage devices 102, the power related components, the centralcomponents that are shared/coupled to the data storage devices 102, orany combination thereof. The enclosure 128 can be adapted with cavitiestherein to support the data storage devices 102. These cavities canenable convenient insertion and extraction of the data storage devices102 (e.g., via quick release mechanisms that enable a single externalmotion to trigger release of a device). Similarly, the enclosure 128 canbe adapted with cavities therein to support, insert, or extract thecentral components. The enclosure 128 can be adapted with cavitiestherein for running the powertrain 108A or the powertrain 108B.

FIG. 2 is a block diagram illustrating a data storage device 200 withina multi-storage-device array (e.g., the multi-storage-device array 100of FIG. 1), in accordance with various embodiments. The data storagedevice 200 can be one of the data storage devices 102 of FIG. 1. Thedata storage device 200 can be coupled to other components of themulti-storage-device array via a data connection 202 (e.g., a detachabledata bus) coupled to a data interface 204. The data interface 204 can bepart of the data storage device 200. The data connection 202, in turn,can be coupled to a storage device adapter (e.g., in themulti-storage-device array) and/or a switching network (e.g., theswitching network 126 of FIG. 1) that communicates with a centralprocessor of the multi-storage-device array.

The data storage device 200 can be powered by a power line 206 (e.g., abranch of the powertrain 108A or the powertrain 108B) coupled to a powerinterface 208. The power interface 208 can be part of the data storagedevice 200. The power interface 208 can include a passive socket forplugging in the power line 206. The power interface 208 can also includean active circuitry for converting power to a particular powerconfiguration (e.g., a certain electrical voltage) required by one ormore functional components of the data storage device 200. In someembodiments, the power interface 208 can include different activecircuitries for converting power according to different configurationsfor different functional components of the data storage device 200.

The data storage device 200 includes a persistent data storage 210(e.g., flash memory, magnetic disks, magnetic tapes, etc.) and a memorycache 212. The persistent data storage 210 can retain its data withoutpower. The memory cache 212, on the other hand, cannot retain its datawithout power. The data storage device 200 can include a drivecontroller 220 for managing data access requests and control commandsreceived at the data interface 204 for data stored or to be stored inthe persistent data storage 210. To alleviate data clogging and/orbottlenecking when writing data from the data interface 204 into thepersistent data storage 210, the drive controller 220 can utilize thememory cache 212 as a staging area for writing client data into thepersistent data storage 210. The memory cache 212 can also storemetadata (e.g., data storage front-end metadata), firmware, and/orlookup tables. In some instances, the drive controller 220 can also usethe memory cache 212 as an output buffer before sending data over thedata interface 204 to other components of the multi-storage-devicearray.

In some instances, the data storage device 200 can include a drive-levelpower failure management module 230 and/or one or more drive-levelholdup energy storages 232 (e.g., one or more batteries or capacitors).The drive-level power failure management module 230 can detect powerfailure events within the data storage device 200 and execute one ormore data protection commands to safeguard data in the memory cache 212from being erased during the power failure event. The drive-level holdupenergy storages 232 can provide power to components within the datastorage device 200 after a power failure event occurs to enable the dataprotection commands to be executed.

The drive-level power failure management module 230 can be a proprietarypower failure management circuit designed specifically for one type ofdata storage device. In several embodiments, the multi-storage-devicearray may include multiple data storage devices that have differentpower failure management modules. In some cases, a failed storage devicehaving a drive-level power failure management module in themulti-storage-device array may be replaced by a new storage devicewithout a drive-level power failure management module. Vice versa, insome cases, a failed storage device without a drive-level power failuremanagement module in the multi storage device array may be replaced by anew storage device having a drive-level power failure management module.

The system-level power failure management circuit (e.g., the powerfailure management circuit 112 of FIG. 1) advantageously providesprevent data loss during power failure events for all client data in itsdata storage devices without being restricted to using storage deviceshaving drive-level power failure management modules. This increases theflexibility of the multi-storage-device array by enabling any storagedevice to be inserted into the multi-storage-device array without firstvetting whether or not it has a drive-level power failure managementmodule.

FIG. 3 is a block diagram of a power failure management circuit 300within a multi-storage-device array (e.g., the multi-storage-devicearray 100 of FIG. 1), in accordance with various embodiments. The powerfailure management circuit 300 includes one or more electric probes(e.g., an electric probe 302A, an electric probe 302B, etc.,collectively as the “electric probes 302”). For example, the electricprobe 302A or the electric probe 302B can be electrically coupled to apowertrain for a subset of data storage devices of themulti-storage-device array or a powertrain specifically for a singledata storage device in the multi-storage-device array. For example, theelectric probe 302A or the electric probe 302B can be electricallycoupled to a power supply module (e.g., a central power supply of themulti-storage-device array) in the multi-storage-device array. Asanother example, the electric probe 302A or the electric probe 302B canbe electrically coupled to a power intake line, drawing power from anexternal power grid, of the multi-storage-device array. As anotherexample, the electric probe 302A or the electric probe 302B can beelectrically coupled to a BBU of the multi-storage-device array.

In some embodiments, the power failure management circuit 300 includes asatellite controller as a failure event controller 304. In otherembodiments, the power failure management circuit 300 can utilize acentral/main processor (e.g., the central processor 122 of FIG. 1) ofthe multi-storage-device array as the failure event controller 304. Thefailure event controller 304 is configured to execute the power failuremanagement processes described in this disclosure.

In some embodiments, the power failure management circuit 300 includes afailure event parameter setting 306. The failure event parameter setting306 can include one or more models or thresholds for determining whethera sensor reading or a series of sensor readings from one of the electricprobes constitute a type of power failure event. Different threshold(s)or model(s) can correspond to different types of power failure events(e.g., an open circuit, a short circuit, or an impending power failure).The failure event parameter setting 306 can include one or moreparameters describing the shutdown priority and/or order of componentswithin the multi-storage-device array corresponding to one type of powerfailure event.

In some embodiments, the power failure management circuit 300 includes abackup power circuitry 308. The backup power circuitry 308 can includeone or more system-level holdup energy storages 310 (e.g., capacitors orbatteries). The backup power circuitry 308 can be configured to providebackup power to the storage devices of the multi-storage-device array.The system-level holdup energy storages 310 are capable of providingpower to one or more specific target storage devices or all of thestorage devices when the input power supply loses power. Thesystem-level holdup energy storages 310 can be part of the power failuremanagement circuit 300 or external to the power failure managementcircuit 300. The power failure management circuit 300 can be configuredto divert power from the system-level holdup energy storages 310 to thetarget storage devices without diverting power to one or morenon-essential components (e.g., components other than the target storagedevices and the power failure management circuit 300) of themulti-storage-device array when the input power supply is functioningabnormally.

Capacitance of the system-level holdup energy storages 310 can beadapted to be sufficient to sustain all of the storage devices to flushpotentially all data respectively from their volatile memories to theirpersistent memories. The system-level holdup energy storages 310 canprovide power to one or more components within the multi-storage-devicearray after a power failure event occurs to enable one or more dataprotection commands to be executed by the failure event controller 304.

For example, the failure event controller 304 can monitor the sensorreadings from the electric probes 302 to determine whether one or morepower related components have failed (e.g., flagging the beginning of apower failure event). The failure event controller 304 can determinewhat type of power failure event is occurring and identify which of thefunctional components of the multi-storage-device array are affected bythe power failure event. In some embodiments, based on the power failureevent type and the identified functional components that are affected,the failure event controller 304 can determine a schedule of shutdownsequence for one or more functional components of themulti-storage-device array.

The electric probes can include a voltage comparator at an input powersupply of the multi-storage-device array. The failure event controller304 can be configured to detect a change in a voltage drop acrossterminals of the input power supply or whether the voltage drop exceedsa voltage threshold (e.g., maximum or minimum threshold). The electricprobes can include a current meter at the input power supply. Thefailure event controller 304 can be configured to detect a change in anelectrical current drawn from the input power supply or whether theelectrical current exceeds a current threshold (e.g., maximum or minimumthreshold).

The failure event controller 304 can be configured to determine whetherany of one or more powertrains to the storage drives is functioningabnormally. The electric probes can include a voltage comparator at apowertrain of a storage drive within the multi-storage-device array. Thepower failure management circuit can be configured to detect a change ina voltage drop across terminals of the powertrain or whether the voltagedrop exceeds a voltage threshold (e.g., maximum or minimum threshold).The electric probes can include a current meter at a powertrain to astorage drive within the multi-storage-device array. The failure eventcontroller 304 can be configured to detect a change in an electricalcurrent drawn from the powertrain or whether the electrical currentexceeds a current threshold (e.g., maximum or minimum threshold).

In some embodiments, the failure event controller 304 can generate oneor more interrupt commands to data storage devices affected by the powerfailure event. An interrupt command is a signal to a storage devicecontroller (e.g., the drive controller 220 of FIG. 2) indicating anevent that needs immediate attention under high-priority or highestpriority (e.g., requiring the interruption of the current code theprocessor is executing). The interrupt command can be configured toinitiate a data flush command to write data from volatile memorycomponents (e.g., the memory cache 212 of FIG. 2) of the data storagedevices to persistent data storages (e.g., the persistent data storage210 of FIG. 2) of the data storage devices. The interrupt command servesto protect loss of data because of the power failure event. In severalembodiments, the system-level holdup energy storages 310 and/or thedrive-level holdup energy storages 232 of FIG. 2 can be adapted to havesufficient electric charge to sustain the data storage devices until theinterrupt command is fully executed.

In some embodiments, the failure event controller 304 can determine apriority sequence of functional components affected by the power failureevent. In response, the failure event controller 304 can route the powerof the system-level holdup energy storages 310 according to the prioritysequence. For example, the failure event controller 304 can prioritizedata storage devices that do not have drive-level holdup energy storagesover data storage devices having drive-level holdup energy storages. Foranother example, the failure event controller 304 can prioritize datastorage devices storing data known not to be backed-up. For anotherexample, the failure event controller 304 can prioritize data storagedevices associated with high-priority external clients.

In some embodiments, the failure event controller 304 is configured toselect one or more target storage devices in the multi-storage-devicearray to send an interrupt command to flush data from their volatilememories to persistent memories. The selection can be based on whether adata storage device has data protection/backup power and/or whether itis affected by the power failure event. The failure event controller 304can access an inventory record (e.g., collected when an operating systemof the multi-storage-device array mounted the data storage device orcollected by a firmware when the data storage devices connected to aswitching network of the multi-storage-device array) of the attributesof the data storage device to determine whether it has dataprotection/backup power capability. The failure event controller 304 candetermine whether the data storage device is affected by the powerfailure event by matching an event type of the power failure eventagainst a table describing attributes of power failure event types.

In these embodiments, the backup power circuitry 308 is configured toprovide backup power only to the target storage devices. For example, atleast some of the electric probes 302 can be storage-drive-specificelectric probes electrically coupled respectively to power trains forthe storage devices in the multi-storage-device array. The failure eventcontroller 304 can be configured to select the target storage devicesbased on sensor readings from the storage-drive-specific electricprobes. In these embodiments, the failure event controller 304 isconfigured to shutdown (e.g., via a hard shutdown or a command-basedsoft shutdown) remaining components in the multi-storage-device arraythat are not part of the power failure management circuit and the targetstorage devices. For example, the failure event controller 304 canshutdown the remaining components by issuing a shutdown command signalor by cutting off power supplied (e.g., from the power supply or fromthe backup power circuitry 308) to the remaining components.

Functional components (e.g., circuits, devices, engines, modules, anddata storages, etc.) associated with the multi-storage-device array 100,the data storage device 200, and/or the power failure management circuit300 can be implemented as a combination of circuitry, firmware,software, or other functional instructions. For example, the functionalcomponents can be implemented in the form of special-purpose circuitry,in the form of one or more appropriately programmed processors, a singleboard chip, a field programmable gate array, a network-capable computingdevice, a virtual machine, a cloud computing environment, or anycombination thereof. For example, the functional components describedcan be implemented as instructions on a tangible storage memory capableof being executed by a processor or other integrated circuit chip. Thetangible storage memory may be volatile or non-volatile memory. In someembodiments, the volatile memory may be considered “non-transitory” inthe sense that it is not a transitory signal. Memory space and storagesdescribed in the figures can be implemented with the tangible storagememory as well, including volatile or non-volatile memory.

Each of the functional components may operate individually andindependently of other functional components. Some or all of thefunctional components may be executed on the same host device or onseparate devices. The separate devices can be coupled through one ormore communication channels (e.g., wireless or wired channel) tocoordinate their operations. Some or all of the functional componentsmay be combined as one component. A single functional component may bedivided into sub-components, each sub-component performing separatemethod step or method steps of the single component.

In some embodiments, at least some of the functional components shareaccess to a memory space. For example, one functional component mayaccess data accessed by or transformed by another functional component.The functional components may be considered “coupled” to one another ifthey share a physical connection or a virtual connection, directly orindirectly, allowing data accessed or modified by one functionalcomponent to be accessed in another functional component. In someembodiments, at least some of the functional components can be upgradedor modified remotely (e.g., by reconfiguring executable instructionsthat implements a portion of the functional components). Other arrays,systems and devices described above may include additional, fewer, ordifferent functional components for various applications.

FIG. 4 is a flow chart of a method 400 of data protection responsive toa power failure event in a multi-storage-device array (e.g., themulti-storage-device array 100 of FIG. 1), in accordance with variousembodiments. The method 400 can be executed by a power failuremanagement circuit (e.g., the power failure management circuit 300 ofFIG. 3) in the multi-storage-device array. At block 402, the powerfailure management circuit monitors an electric probe (e.g., a voltagecomparator or a current meter) to a power-related component in themulti-storage-device array. The electric probe can be one of theelectric probes 302 of FIG. 3. The power-related component can be apower supply (e.g., one of the power supply modules 104 of FIG. 1) forpart of or the entire multi-storage-device array (e.g., all activecomponents within the multi-storage-device array). At block 404, thepower failure management circuit determines whether power delivery viathe power-related component to the multi-storage-device array isfunctioning abnormally. A power-related component can be deemed“functioning abnormally,” when the power related component has an opencircuit (e.g., no current on a current meter) or a short-circuit (e.g.,no voltage drop across the power-related component's terminals). Apower-related component can also be deemed “functioning abnormally,”when the power-related component has fluctuating, fluttering, erratic,decreasing, and/or escalating electric current draw and/or voltagedifference across the terminals.

Responsive to determining that the power delivery is functioningabnormally, the power failure management circuit generates and sends aninterrupt signal to a storage device in the multi-storage-device arrayat block 406. The interrupt signal can be a data flushing command. Forexample, the power failure management circuit can send the interruptsignal to a drive controller of the storage device via a storage adapterfor the storage device and/or a switching network (e.g., the switchingnetwork 126 of FIG. 1). The power failure management circuit cangenerate the interrupt signal as a highest priority command according toa storage device communication protocol (e.g., SAS protocol or PCIeprotocol).

In some embodiments, at block 408, the power failure management circuitcommands one or more non-essential components of themulti-storage-device array to shutdown in response to determining thatthe power delivery is functioning abnormally. For example, this mayinclude shutting down a main processor (e.g., the central processor 122of FIG. 1) used by the multi-storage-device array to process clientrequests received from a network interface (e.g., the network interface120 of FIG. 1) of the multi-storage-device array. For another example,this may include shutting down the network interface. At block 410, thepower failure management circuit can provide backup power from asystem-level holdup energy storage to the storage device withoutproviding the backup power to the client request processor and/or thenetwork interface of the multi-storage-device array. The backup powercan be used by the storage device to execute the data flushing commandrepresented by the interrupt signal.

At block 412, the power failure management circuit can query the drivecontroller of the storage device to determine whether the data flushingcommand has been fully executed. At block 414, the power failure circuitcan receive a message from the drive controller indicating completion ofthe data flushing command. In some embodiments, the power failuremanagement circuit can cutoff backup power to the storage device inresponse to receiving the message indicating the completion of the dataflush command.

While processes or blocks are presented in a given order in FIG. 4,alternative embodiments may perform routines having steps, or employsystems having blocks, in a different order, and some processes orblocks may be deleted, moved, added, subdivided, combined, and/ormodified to provide alternative or subcombinations. Each of theseprocesses or blocks may be implemented in a variety of different ways.In addition, while processes or blocks are at times shown as beingperformed in series, these processes or blocks may instead be performedin parallel, or may be performed at different times. When a process orstep is “based on” a value or a computation, the process or step shouldbe interpreted as based at least on that value or that computation.

Some embodiments of the disclosure have other aspects, elements,features, and steps in addition to or in place of what is describedabove. These potential additions and replacements are describedthroughout the rest of the specification.

What is claimed is:
 1. A computer-implemented method of operating amulti-storage-device array, comprising: monitoring an electric probe toa power-related component in the multi-storage-device array for abnormalfunction of power delivery; and responsive to detecting abnormalfunction of the power delivery, providing power to a storage devicewithout providing the power to a client request processor of themulti-storage-device array.
 2. The computer-implemented method of claim1, further comprising: responsive to determining that the power deliveryis functioning abnormally, commanding the client request processor toshutdown.
 3. The computer-implemented method of claim 1, furthercomprising: responsive to determining that the power delivery isfunctioning abnormally, generating an interrupt signal to the storagedevice in the multi-storage-device array.
 4. The computer-implementedmethod of claim 1, wherein determining that power delivery to themulti-storage-device array is functioning abnormally is performed via acontroller connected to the electric probe electrically coupled to acentral power supply.
 5. The computer-implemented method of claim 4,wherein the electric probe is a voltage comparator, and the centralpower supply is a power supply for components within themulti-storage-device array.
 6. The computer-implemented method of claim1, further comprising: sending an interrupt signal to a drive controllerof the storage device, wherein the interrupt signal represents a highestpriority command for the drive controller according to a storagecommunication protocol.
 7. A multi-storage-device array, comprising: aclient request processor configured to process external client requeststo read or write data from a storage drive among themulti-storage-device array; and a power failure management circuitcoupled to a central power interface and the client request processor,wherein the power failure management circuit is configured to providepower to the storage drive without providing power to the client requestprocessor.
 8. The multi-storage-device array of claim 7, wherein thepower failure management circuit is further configured to: send aninterrupt signal to a drive controller of a target storage drive toflush data from the volatile memory of the target storage drive to apersistent memory of the target storage drive, responsive to detectingan input power supply is functioning abnormally.
 9. Themulti-storage-device array of claim 7, wherein the power failuremanagement circuit includes a satellite controller separate from theclient request processor; and wherein the satellite controller isconfigured to detect a power failure event from at least a sensorreading of an electric probe and determine whether to send the interruptsignal to a drive controller to flush the data.
 10. Themulti-storage-device array of claim 7, wherein the power failuremanagement circuit detects a power failure event from at least a sensorreading of an electric probe.
 11. The multi-storage-device array ofclaim 7, wherein the power failure management circuit is configured todetermine whether any of one or more powertrains to the storage drivesis functioning abnormally.
 12. The multi-storage-device array of claim7, wherein the power failure management circuit is configured to: detecta change in a voltage drop across terminals of an input power supply;detect a change in a voltage drop across terminals of a powertrain;determine whether any voltage drop exceeds a threshold; detect a changein an electrical current drawn from the input power supply; detect achange in the electrical current drawn from the powertrain; determinewhether any change in the electrical current exceeds a threshold; or anycombination thereof.
 13. The multi-storage-device array of claim 7,wherein the power failure management circuit is configured toselectively shutdown a component, other than the target storage drive,of the multi-storage-device array while the target storage drive isflushing the data from the volatile memory to a persistent memory. 14.The multi-storage-device array of claim 7, further comprising: asystem-level holdup energy storage capable of providing power to thetarget storage drive when an input power supply loses power.
 15. A powerfailure management circuit for operating a multi-storage-device array,comprising: a controller to detect abnormal function of power deliveryto any storage device among the multi-storage-device array; and a backuppower circuitry to provide power to a target storage device withoutproviding the power to a client request processor of themulti-storage-device array.
 16. The power failure management circuit ofclaim 15, wherein the controller detects abnormal function of powerdelivery based on a sensor reading of an electric probe.
 17. The powerfailure management circuit of claim 15, wherein the controller isconfigured to generate an interrupt command to storage devices in themulti-storage-device array to flush data stored in volatile memories ofthe storage devices to persistent memories of the storage devices. 18.The power failure management circuit of claim 15, wherein the controlleris configured to select one or more target storage devices in themulti-storage-device array to send the interrupt command; and whereinthe backup power circuitry is configured to provide backup power only tothe selected one or more target storage devices.
 19. The power failuremanagement circuit of claim 15, wherein the controller is configured toshutdown remaining components in the multi-storage-device array that arenot part of the power failure management circuit and the target storagedevices by issuing one or more shutdown command signals and/or cuttingoff power supplied to the remaining components.
 20. The power failuremanagement circuit of claim 15, further comprising: an electric probeelectrically coupled to a power train for storage devices in themulti-storage-device array; and wherein the controller is configured toselect the target storage devices based on sensor readings from thestorage-drive-specific electric probes.